
2009-2011 Microchip Technology Inc. DS22194B-page 51
MCP660/1/2/3/4/5/9
APPENDIX A: REVISION HISTORY
Revision B (September 2011)
The following is the list of modifications:
1. Added the MCP660, MCP664 and MCP669
amplifiers to the product family and the related
information throughout the document.
2. Added the 4x4 QFN (16L) package option for
MCP660 and MCP669, SOIC and TSSOP (14L)
package options for MCP660 and MCP665 and
the related information throughout the docu-
ment. Updated Package Types drawing with pin
designation for each new package.
3. Updated Ta bl e 1 -4 to show the temperature
specifications for new packages.
4. Updated Ta bl e 3- 1 to show all the pin functions.
5. Updated Section 6.0 “Packaging Informa-
tion” with markings for the new additions.
Added the corresponding SOIC and TSSOP
(14L), and 4x4 QFN (16L) package options and
related information.
6. Updated table description and examples in
Product Identification System.
Revision A (July 2009)
Original release of this document.
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